
Building chips up: wafer-scale, MoS₂ electronics for BEOL integration
When we think of faster, cheaper electronics, we usually think “smaller transistors.” But the future is also about stacking—adding new layers of components on top of finished silicon chips. That’s called back‑end‑of‑line (BEOL) integration, and it only works if everything you add can be made at low temperatures (generally below ~400–450 °C), otherwise you damage […]